TechSolve receives $250K Edison grant
The Ohio Department of Development has awarded a $250,000 Thomas Edison Program grant to Bond Hill-based TechSolve, Inc.The grant will be used to provide Edison Technology and Industry Center Services in concert with the National Institute of Standards and Technology and the Manufacturing Extension Partnership Program in the City of Cincinnati.Non-profit TechSolve helps local manufacturing companies improve efficiency and compete in the global marketplace.The Thomas Edison Program provides grants to aid research, development, and technology transfer efforts by enterprises and educational institutions.Read the full release here.
The Ohio Department of Development has awarded a $250,000 Thomas Edison Program grant to Bond Hill-based TechSolve, Inc.
The grant will be used to provide Edison Technology and Industry Center Services in concert with the National Institute of Standards and Technology and the Manufacturing Extension Partnership Program in the City of Cincinnati.
Non-profit TechSolve helps local manufacturing companies improve efficiency and compete in the global marketplace.
The Thomas Edison Program provides grants to aid research, development, and technology transfer efforts by enterprises and educational institutions.
Read the full release here.
Author
